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Samsung M393B5673DZ1-CH9 2GB DDR3 RDIMM 1333MT/s | Reliable ECC

MPN:M393B5673DZ1-CH9 By:Samsung Warranty:1 year
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General

ModelM393B5673DZ1-CH9
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity2 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x8
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

Designed specifically for server environments, this M393B5673DZ1-CH9 is a DDR3-1333 Registered ECC RDIMM that excels in memory-intensive workloads such as virtualization and in-memory databases, where its ECC and registered signaling ensure data integrity and signal stability under high-density configurations. The dual-rank x8 organization enables balanced interleaving for improved bandwidth efficiency, while the CL9 latency keeps response times tight at the module's native 1333 MHz speed.

Technical Specs & Insights

1. ECC actively corrects single-bit errors in real time, preserving data integrity for financial transactions and preventing costly silent corruption in long-running virtualization workloads.
2. Registered buffering stabilizes command and address signals across fully populated memory channels, allowing dense server configurations to scale capacity without compromising reliability.
3. Dual Rank interleaving keeps the memory pipeline saturated by alternating bank accesses, which lifts aggregate throughput under heavy multi-tenant or containerized services.
4. A per-channel bandwidth of over ten gigabytes per second efficiently absorbs concurrent data streams, sustaining responsive file serving and collaboration platforms during peak loads.
5. The fast column-access response reduces the stall cycles per miss, directly accelerating cache-line fetches that benefit low-latency database queries and indexing operations.

Why These Specs Matter

For virtualization clusters and in-memory databases, the M393B5673DZ1-CH9 DDR3 Registered ECC RDIMM transforms common server pain points into strengths. Its ECC technology silently corrects single-bit errors induced by cosmic radiation or electrical noise, preventing corrupt data from crashing VMs or undermining database accuracy—a single flipped bit could cost hours of troubleshooting. The registered buffer cleanly redrives address commands, allowing you to fully populate high-capacity 2-Socket systems with stable signaling, eliminating intermittent failures that plague large RAM configurations. The dual-rank x8 design leverages internal interleaving to deliver higher sustained bandwidth for memory-intensive workloads like Redis caching or SAP HANA analytics, keeping transaction latencies under microseconds. Finally, the 1333MHz speed at CL9 offers a sweet spot of reliable throughput and 1.5V power draw, which matters when hundreds of modules run 24/7. Combined, these attributes ensure your servers deliver continuous, error-free performance where every byte counts.

Endurance & Reliability

The M393B5673DZ1-CH9 is a 2GB DDR3-1333 ECC Registered DIMM for servers. Capacity planning guidelines for typical workloads:

General Virtualization
For light virtualization, populate each memory channel with one identical 2GB RDIMM. In a dual-socket server with three channels per CPU, six modules (12GB) or twelve modules (24GB) suit a few VMs. Fully populating channels ensures interleaving stability despite the small density.

In-Memory Database
In-memory databases demand maximum capacity and ECC protection. Fill all DIMM slots—24 modules delivering 48GB—for lightweight Redis or Memcached instances. Use identical registered DIMMs to avoid ECC and timing mismatches. For larger datasets, deploy multiple nodes because 48GB is the ceiling with these modules.

High-Performance Computing
HPC workloads require balanced bandwidth via multi-channel interleaving. Install one 2GB RDIMM per channel per CPU (six or eight modules) to achieve peak throughput at 1333MHz CL9. The dual-rank design sustains performance; add a second DIMM per channel for extra capacity if the controller allows. This configuration delivers reliable, low-latency data access for compute-bound tasks.

Verified Compatibility

Rigorously validated server memory, compatible with Dell PowerEdge R720, R620, HP DL380p Gen8, and similar systems.

FAQ

Q: Can I mix this M393B5673DZ1-CH9 with other memory modules of different brands or speeds?

A: Mixing is not recommended. For registered ECC DDR3, all DIMMs should share identical speed, rank, and timing to maintain signal integrity and avoid POST or stability issues.

Q: Is this memory compatible with my system?

A: Designed for servers with DDR3 Registered ECC support, it fits Intel Xeon E5-series or AMD Opteron 6300 platforms. Verify your board’s qualified vendor list to ensure 2GB RDIMM compatibility.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical DIMMs per channel starting with the farthest slot from the CPU. For dual-processor systems, balance capacity evenly across both memory controllers to maximize interleaving and bandwidth.

Q: Does this module support overclocking or XMP profiles?

A: No. This server-grade Registered DIMM adheres strictly to JEDEC DDR3-1333 CL9 profiles. Overclocking or XMP is unsupported, as reliability and error correction take priority.

Q: What warranty and typical failure rate can I expect?

A: It carries a one-year warranty. Enterprise-class Samsung RDIMMs exhibit very low annualized failure rates, typically under 0.5%, thanks to rigorous screening and ECC protection.

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