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Samsung M393B5673EH1-CH9 2GB DDR3 RDIMM 1333MT/s | Registered ECC

MPN:M393B5673EH1-CH9 By:Samsung Warranty:1 year
US$145 - $158
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General

ModelM393B5673EH1-CH9
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity2 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x8
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

Designed for server platforms, this 2GB DDR3-1333 RDIMM with ECC and registered signal buffering ensures data integrity and system stability in memory-intensive workloads such as virtualization and in-memory databases. Its CL9 timing and dual-rank x8 configuration deliver a balanced latency profile while maintaining signal quality across dense DIMM populations.

Technical Specs & Insights

1. ECC protection automatically detects and corrects single-bit memory errors, safeguarding transactional databases and financial workloads from silent data corruption in always-on server environments.
2. Registered signal buffering stabilizes command and address lines, enabling high-density memory populations essential for virtualized server clusters and large-scale in-memory computing.
3. Dual Rank x8 organization leverages rank interleaving to boost effective memory bandwidth, reducing latency spikes when multiple virtual machines access their data simultaneously.
4. 1333MHz speed delivers a reliable 10.6 GB/s peak throughput per channel, supporting moderate-throughput enterprise applications without overshooting power budgets in rack-dense deployments.
5. 2 GB capacity per module allows precise memory provisioning for lightweight containers and microservices, maximizing workload consolidation density in blade and micro-server architectures.

Why These Specs Matter

The Samsung M393B5673EH1-CH9 is a server-grade Registered DIMM engineered for mission-critical enterprise environments. In a virtualization cluster, where a single host might run dozens of virtual machines, memory stability is non-negotiable. This module’s Registered architecture buffers the command and address signals, allowing you to pack the board with dense memory populations without signal degradation. That directly translates to rock-solid uptime for your hypervisor and the virtualized workloads it carries.

Paired with ECC error correction, the module continuously detects and fixes single-bit data corruption. For an in-memory database like Redis or SAP HANA, a flipped bit isn’t just a glitch—it can silently corrupt a live financial transaction or an analytics result set. ECC turns that risk into a self-healing process, preserving data integrity without manual intervention.

The dual-rank x8 organization further elevates real-world throughput. It enables rank interleaving, so while one rank is refreshing, the memory controller can immediately access the other. This parallelism reduces latency spikes under the heavy, random access patterns typical of database index scans or multi-tenant cloud platforms. Combined with the standard DDR3-1333 speed and CL9 latency, the M393B5673EH1-CH9 delivers the balanced predictability that infrastructure managers depend on to keep services responsive and data absolutely trustworthy.

Endurance & Reliability

General Virtualization
These 2 GB DDR3 RDIMMs are best deployed in balanced, multi-channel configurations for virtualized environments. Populate all memory channels identically—aim for at least 8 modules (16 GB) for light hypervisor tasks or 16 modules (32 GB) to support a modest number of virtual machines. ECC and registered signaling ensure stability under the multi‑tenant demands typical of general virtualization.

In‑Memory Database
In‑memory database workloads require maximum capacity and strong data integrity. Use the largest possible count of these dual‑rank x8 modules across all available slots—for example, 18 or 24 DIMMs to reach 36–48 GB—and configure symmetric population to leverage rank interleaving. The ECC RDIMM design protects against single‑bit errors, critical for transactional consistency in memory‑resident datasets.

High‑Performance Computing
For HPC, aggregate memory bandwidth often outweighs raw capacity. Install one identical 2 GB RDIMM per memory channel to maximize bandwidth through balanced interleaving (e.g., 6 or 8 DIMMs per socket). Although the 1333 MT/s speed limits peak throughput, the dual‑rank layout and registered clocking help sustain stable, high‑utilization throughput in tightly‑coupled compute clusters. Keep all DIMMs uniform to avoid performance penalties.

Verified Compatibility

Rigorously validated for servers: Dell PowerEdge R710/R720, HP DL380 G7/G8, and more.

FAQ

Q: Can I mix this M393B5673EH1-CH9 with other memory modules of different brands or speeds?

A: Mixing is not recommended. For server stability, use identical modules. If mixed, the system defaults to the slowest DIMM and may disable ECC or cause POST issues.

Q: Is this memory compatible with my Intel or AMD server platform?

A: It is designed for DDR3-based servers supporting registered ECC RDIMMs. Compatible platforms include Intel Xeon 5500/5600 series and AMD Opteron 6100 series, but verify motherboard qualification.

Q: What is the recommended DIMM population order for optimal performance?

A: Follow your server’s manual; typically, populate identical DIMMs per channel starting from the farthest slot from the CPU. Balance ranks across channels to maintain interleaving and maximum bandwidth.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a JEDEC-compliant server RDIMM running at fixed 1333MHz with CL9. Overclocking or XMP is not supported; stability and data integrity are prioritized over performance tuning.

Q: What warranty and typical failure rate can I expect?

A: This module includes a one-year warranty. It maintains an annualized failure rate (AFR) below 0.5% under normal server operating conditions, ensuring high reliability for enterprise workloads.

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