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Samsung M393B5673EH1-CH9Q1 2GB DDR3 RDIMM 1333MT/s | Reliable ECC

MPN:M393B5673EH1-CH9Q1 By:Samsung Warranty:1 year
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General

ModelM393B5673EH1-CH9Q1
Product TypeMemory Module
Compliance StandardsEU RoHS,FCC
Memory Capacity2 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x8
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

Designed as a server-grade RDIMM, this DDR3-1333 module with ECC and registered signaling is ideal for virtualization hosts and memory-intensive database workloads that demand data integrity. Its dual-rank x8 organization at CL9 latency enhances signal stability and capacity scaling in multi-DIMM configurations, ensuring reliable operation under sustained enterprise loads.

Technical Specs & Insights

1. ECC error correction safeguards transactional data integrity, preventing silent memory corruption in financial or database server workloads.
2. Registered signal buffering enables high-capacity memory configurations, crucial for scaling virtualized environments without signal degradation.
3. Dual Rank x8 organization utilizes rank interleaving to boost effective bandwidth, improving response times for concurrent virtual machine requests.
4. 1333MHz clock speed delivers consistent data throughput for memory-intensive enterprise applications, balancing performance with power consumption.
5. 1.5V standard voltage ensures robust electrical compatibility with server boards and minimizes heat stress during non-stop operation.

Why These Specs Matter

The Samsung M393B5673EH1-CH9Q1 is a server-grade DDR3 Registered DIMM, purpose-built for data centers where reliability and scalability are non-negotiable. Its ECC capability directly guards against silent data corruption caused by single-bit errors—a critical safeguard when running an in-memory database like SAP HANA, where even one flipped bit can crash a transaction or skew financial records. Registered buffering decouples the memory chips from the CPU’s command bus, stabilizing signal integrity as you populate all 24 DIMM slots on a dual-socket board. This becomes essential in a dense virtualization cluster: without it, populating large amounts of RAM would invite signal degradation and unpredictable system halts, directly threatening the dozens of VMs hosting your business applications. The Dual Rank x8 organization further benefits these workloads by enabling rank interleaving, which overlaps read/write cycles to deliver sustained bandwidth when multiple virtual machines simultaneously hammer the memory subsystem. Combined with the energy-conscious 1.5V operating voltage and a 1333MHz speed at CL9 latency, this module delivers a tuned balance between throughput and power draw—keeping your hypervisor nodes stable, your database queries fast, and your operating costs predictable across years of 24/7 operation.

Endurance & Reliability

General Virtualization
For a typical hypervisor host running multiple VMs, memory capacity and reliability are paramount. Populate the server with at least six to eight identical 2 GB RDIMMs per CPU to balance cost and density, ensuring a total of 12–16 GB to handle moderate loads. Leverage the module’s ECC and registered features to maintain uptime, and always install DIMMs in matched sets to preserve multi-channel interleaving.

In-Memory Database
In-memory databases demand low latency and high availability, making ECC RDIMMs a baseline requirement. Deploy the maximum supported number of these 1333 MHz modules—often 12 or more per server—to reach 24 GB or greater, placing the entire dataset in RAM. Configure all memory channels symmetrically and avoid mixing speeds or ranks to prevent training errors that could introduce latency spikes.

High-Performance Computing (HPC)
HPC clusters prioritize memory bandwidth alongside capacity, so populate every memory channel with a single dual-rank x8 DIMM. For a dual-socket node, install eight 2 GB RDIMMs per CPU (16 total, 32 GB) to achieve peak bandwidth and minimize channel imbalance. The registered ECC design sustains large-scale simulations that are sensitive to silent data corruption.

Verified Compatibility

Rigorously tested server memory, compatible with Dell PowerEdge R710/R720, HP ProLiant DL380 G7, IBM System x3650 M3, and more.

FAQ

Q: Can I mix this M393B5673EH1-CH9Q1 with other memory modules of different brands or speeds?

A: Mixing different brands or speeds with registered ECC memory is not recommended. It can cause system instability or unbootable states. For mission-critical servers, install identical modules with matching part numbers, rank, and CAS latency.

Q: Is this memory compatible with my system?

A: This DDR3-1333 registered ECC RDIMM is designed for server platforms such as Intel Xeon 5500/5600 series or AMD Opteron 6000 series. Please verify your motherboard supports 240-pin Registered DIMMs and consult the manufacturer’s Qualified Vendor List.

Q: What is the recommended DIMM population order for optimal performance?

A: Follow your server board manual for balanced memory configuration. Typically, populate identical DIMMs per channel starting with the slots farthest from the CPU. For dual-rank x8 modules, filling one DIMM per channel enables full 1333MHz speed and channel interleaving.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a JEDEC-compliant registered ECC server module. It does not support overclocking or XMP profiles. Its design prioritizes strict signal integrity and data reliability over frequency flexibility.

Q: What warranty and typical failure rate can I expect?

A: This module includes a one-year warranty. As an enterprise-grade registered ECC DIMM, it delivers extremely low annualized failure rates, typically well below 0.5% under specified operating conditions, ensuring high mission-critical reliability.

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