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| Model | M393B5673FH0-CH9Q4 |
|---|---|
| Product Type | Memory Module |
| Compliance Standards | EU RoHS,FCC |
| Memory Capacity | 2 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.5V |
| RAM Speed | 1333MHz |
| RAM Standard | DDR3-1333/PC3-10600 |
| Error Identifying | ECC |
| Signal Type | Registered |
| Column Access Strobe (CAS) | CL9 |
| Rank | Dual Rank x8 |
| Quantity of Pins | 240-pin |
| RAM Genre | RDIMM |
Designed as a server-grade DDR3 RDIMM, the M393B5673FH0-CH9Q4 is purpose-built for virtualization platforms and in-memory databases, where its integrated ECC and registered signal architecture ensure critical data integrity and robust signal stability under fully populated multi-DIMM configurations. The dual-rank x8 organization with CL9 latency delivers balanced throughput and capacity scaling, making it an optimal fit for enterprise workloads that demand both reliability and consistent performance.
1. ECC memory corrects single-bit errors on the fly, ensuring financial and database workloads run with absolute data integrity across always-on servers.
2. Registered buffering permits fully loaded memory channels without signal collapse, making it ideal for dense virtualization farms requiring hundreds of gigabytes of RAM.
3. Dual Rank x8 organization leverages rank interleaving to fully utilize the memory bus, sustaining peak throughput for numerous simultaneous VMs.
4. The 2 GB density suits dedicated lightweight server functions—such as DNS or edge routers—where minimal power draw and low total cost matter most.
5. CL9 latency shortens the critical data fetch window, improving query execution speed for high-transaction databases and caching layers.
The Samsung M393B5673FH0-CH9Q4 is a server-grade DDR3 Registered DIMM (RDIMM) engineered for enterprise reliability. In a virtualized cluster, its ECC (Error-Correcting Code) capability is non-negotiable: it automatically detects and corrects single-bit memory errors, preventing silent data corruption that could crash hypervisors or corrupt virtual machine states. This translates directly to uninterrupted service and data integrity for your critical workloads. The Registered buffer reduces electrical load on the memory controller, allowing you to populate multiple DIMMs per channel to achieve higher capacities—essential when scaling up virtual machine density or running large in-memory databases like SAP HANA. Moreover, its Dual Rank x8 architecture employs interleaving to deliver higher sustained bandwidth and lower latency than single-rank modules. For Redis, this means faster responses and smoother throughput under heavy load. The DDR3-1333 speed and CL9 timing provide a proven balance of performance and stability, ensuring seamless compatibility and consistent 24/7 operation.
General Virtualization
For a moderate consolidation of 10–15 virtual machines, install at least eight 2 GB RDIMMs (16 GB total) evenly across all memory channels to maintain balanced interleaving. Dual-rank x8 modules ensure stable ECC protection under mixed workloads. Scale up to 16 identical modules (32 GB) when hosting heavier guests or reserving failover capacity.
In-Memory Database
In-memory datasets demand maximised capacity and fault tolerance. Populate every available DIMM slot with these 2 GB registered ECC sticks, targeting 64–128 GB depending on server board limits. Keeping all modules identical avoids timing conflicts, and the registered architecture permits fully loaded configurations without signal degradation — crucial for Redis or SAP HANA-style workloads.
High-Performance Computing
HPC jobs require peak bandwidth, so install an equal number of modules per memory channel to enable symmetric interleaving. A 12-DIMM (24 GB) or 16-DIMM (32 GB) configuration on dual-socket systems supplies consistent 1333 MT/s throughput. The CL9 latency and dual-rank design deliver low-latency access for tightly-coupled parallel simulations while ECC scrubbing safeguards long-running computations.
Rigorously tested, compatible with Dell PowerEdge R720, HP DL380p Gen8, Lenovo RD430, and similar servers.
Q: Can I mix this M393B5673FH0-CH9Q4 with other memory modules of different brands or speeds?
A: Mixing different brands or speeds is not recommended for server environments. Even identical specs can cause instability due to subtle timing differences. For reliable ECC and registered operation, use identical, validated modules.
Q: Is this memory compatible with my system? Intel or AMD server platforms?
A: This DDR3-1333 Registered ECC RDIMM is compatible with servers using Intel Xeon E5-2600 v1/v2 or AMD Opteron 6300 series platforms. Verify your motherboard supports 240-pin, 1.5V RDIMMs and dual-rank x8 configuration.
Q: What is the recommended DIMM population order for optimal performance?
A: Populate identical DIMMs per channel, filling blue slots first, then black. For dual-processor systems, balance memory across CPUs. Always follow your server’s memory population guide to maintain proper interleaving and ECC functionality.
Q: Does this module support overclocking or XMP profiles?
A: No. This is a server-grade Registered ECC module built to JEDEC DDR3-1333 standard. Overclocking and XMP are unsupported, as they compromise signal integrity and error correction, which are critical for 24/7 enterprise stability.
Q: What warranty and typical failure rate can I expect?
A: This module includes a 1-year warranty. Typical failure rate is very low in properly cooled environments. ECC corrects single-bit errors, further reducing downtime. Return rate averages under 0.5% annually for this product line.