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Trade Assurance
| item | value |
|---|---|
| Basic Information | Product Collection |
| 9282 | Basic Information |
| Cascade Lake-AP | Basic Information |
| BGA5903 | Architecture & Package |
| 双芯封装 (Dual-Die) | Architecture & Package |
| 56 | Performance |
| 112 | Performance |
| 2.6 GHz | Performance |
| 3.4 GHz | Performance |
| 3.8 GHz | Performance |
| 77 MB | Performance |
| 14 nm | Architecture & Process |
| 1 | Architecture & Process |
| 4 TB | Memory |
| DDR4-2933 | Memory |
| 12 | Memory |
| 281.6 GB/s | Memory |
| 3 | Expansion |
| 10.4 GT/s | Expansion |
| 3.0 | Expansion |
| 64-bit | Advanced Technologies |
| 2.0 | Advanced Technologies |
| 是 | Advanced Technologies |
| 是 | Advanced Technologies |
| 400 W | Power |
