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Micron MT36KSZF2G72LZ-1G4D1 16GB DDR3 RDIMM 1333MHz | Registered ECC

MPN:MT36KSZF2G72LZ-1G4D1 By:Micron Warranty:1 year
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General

ModelMT36KSZF2G72LZ-1G4D1
Product TypeMemory Module
Compliance StandardsRoHS
Memory Capacity16 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

This 16GB DDR3L-1333 registered ECC module (1.35V, CL9) is engineered for enterprise servers and is ideally suited for memory-intensive workloads such as virtualization and in-memory databases where data integrity is critical. Its dual-rank x4 organization paired with registered signaling ensures robust signal integrity and maximum capacity scalability in multi-DIMM configurations, while the low operating voltage reduces power consumption in high-density deployments.

Technical Specs & Insights

1. ECC protection silently corrects single-bit errors, preserving data integrity in transactional databases and financial workloads where even a single corrupt bit is unacceptable.
2. Registered signal buffering stabilizes command and address lines across high-density memory configurations, enabling servers to scale up capacity without compromising signal integrity.
3. Dual Rank x4 interleaving keeps the memory channel fully saturated, delivering consistent throughput essential for running multiple virtual machines under heavy consolidation.
4. Sixteen-gigabyte module capacity maximizes memory density per slot, allowing hypervisors to provision more virtual machines on the same physical footprint.
5. Low-voltage operation reduces datacenter power draw and thermal load, lowering total cost of ownership while maintaining stable performance in always-on environments.

Why These Specs Matter

The MT36KSZF2G72LZ-1G4D1 is a 16GB DDR3L RDIMM purpose-built for mission-critical server environments. Its four key attributes directly address real operational challenges. ECC detects and corrects single-bit errors that can silently corrupt data; in a virtualized cluster, this prevents unplanned VM crashes, and in an in-memory database like Redis, it safeguards transactional accuracy. Registered buffering stabilizes command and address signals, allowing you to fully populate DIMM slots for high-density configurations without signal degradation—vital when consolidating numerous VMs onto fewer physical servers. Dual Rank x4 construction enables rank interleaving, which overlaps memory accesses to reduce latency and boost throughput for database queries. Operating at 1.35V, the module draws less power than legacy 1.5V DDR3, directly lowering energy bills and thermal stress across your server farm. For virtualized and data-intensive workloads, this memory delivers the uncompromising reliability and efficiency your business demands.

Endurance & Reliability

General Virtualization
Populate servers with multiple 16 GB RDIMMs to achieve 128–256 GB per node, ensuring each memory channel is equally filled for optimal interleaving. This capacity comfortably supports dozens of VMs, while the 1.35 V low-power operation helps reduce TCO in dense virtualization clusters. Paired registered buffering and ECC safeguard multi-tenant stability.

In-Memory Database
Maximise capacity by filling all available DIMM slots—for example, 16 of these dual‑rank x4 modules in a dual‑socket server delivers 256 GB, allowing entire datasets to reside in RAM. ECC and registered signal integrity are critical for transactional consistency, and the 16 GB density hits a sweet spot between module count and capacity headroom for demanding in‑memory workloads.

High Performance Computing (HPC)
Configure one module per memory channel (often eight 16 GB RDIMMs in a dual‑socket node) to maximise bandwidth through full channel interleaving. Although DDR3-1333 is moderate, balanced population minimises latency penalties, and registered ECC maintains data integrity during sustained parallel number‑crunching, making it suitable for throughput‑oriented HPC pipelines.

Verified Compatibility

Rigorously tested, compatible with servers like Dell PowerEdge R720, HP ProLiant DL380p Gen8, and more.

FAQ

Q: Can I mix this MT36KSZF2G72LZ-1G4D1 with other memory modules of different brands or speeds?

A: Mixing RDIMMs with different brands or speeds is not recommended. The system will default to the lowest speed and may face stability issues. For mission‑critical servers, use identical Micron modules to ensure validated RAS and compatibility.

Q: Is this memory compatible with my Intel Xeon E5-2400 or AMD Opteron 6300 server platform?

A: This 16GB DDR3L-1333 registered ECC module is designed for dual‑socket servers using Intel C600 or AMD SR5690 chipsets. Verify your board supports 1.35V low‑voltage RDIMMs and 1333MT/s speeds for proper operation.

Q: What is the recommended DIMM population order for optimal performance on my dual‑processor server?

A: Populate identical DIMMs per memory channel, starting with the blue slots farthest from each CPU. Balance capacity across both processors. For dual‑rank x4 RDIMMs like this, follow your vendor’s slot numbering to maintain interleaving and full bandwidth.

Q: Does this RDIMM support overclocking or XMP profiles?

A: No. This is an enterprise‑grade registered ECC module conforming to JEDEC DDR3-1333/PC3-10600 standards. It does not support overclocking or XMP, as server memory prioritizes data integrity and stability over variable frequency operation.

Q: What warranty and typical failure rate can I expect for this Micron module?

A: This module includes a 1‑year direct warranty. As a genuine Micron RDIMM, it delivers extremely low annualized failure rates (typically <0.1%) when operated within JEDEC specifications, ensuring high reliability in 24/7 server environments.

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