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Micron MT36KSF2G72PZ-1G6E1HE 16GB DDR3 RDIMM 1600MT/s | Reliable ECC

MPN:MT36KSF2G72PZ-1G6E1HE By:Micron Warranty:1 year
US$103 - $112
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General

Product TypeMemory Module
Compliance StandardsRoHS
Memory Capacity16 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1600MHz
RAM StandardDDR3-1600/PC3-12800
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL11
RankDual Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

This registered ECC DDR3-1600 module, operating at a low 1.35V, is purpose-built for server platforms where data integrity is critical, making it an excellent fit for memory-intensive virtualization and in-memory database workloads. Its dual-rank x4 organization and registered signal type ensure stable electrical loading and reliable operation in dense multi-DIMM configurations, while ECC protection guards against single-bit errors in always-on environments.

Technical Specs & Insights

1. End-to-end ECC protection eliminates silent data corruption, a non-negotiable requirement for financial transactions and mission-critical databases.
2. Registered clock buffering maintains signal integrity across fully populated memory channels, ensuring rock-solid uptime in virtualized server clusters.
3. This density tier allows higher VM density per rack, reducing cost-per-guest in consolidated private cloud deployments.
4. Dual Rank x4 organization saturates server memory interleaving, boosting throughput for in-memory analytics and large-scale content caches.
5. Operating at 1.35V dramatically lowers DRAM power consumption, cutting cooling overhead in dense data center environments.

Why These Specs Matter

In a data center, unplanned downtime is measured in lost revenue and trust. The Micron MT36KSF2G72PZ-1G6E1HE, a 16GB DDR3-1600 Registered ECC module, transforms four critical design choices into real-world resilience. Its ECC technology silently corrects single-bit memory errors caused by cosmic radiation or aging silicon—not just an abstract feature, it means your in-memory database never serves corrupted transaction records, and your hypervisor cluster avoids a cascade of VM crashes from a flipped bit. Registered logic buffers the command and address lines, stabilizing signal integrity when all 24 DIMM slots in a virtualization host are populated; this lets you scale to hundreds of virtual machines without the boot-time memory training failures that haunt unbuffered designs. The dual-rank x4 organization interleaves accesses across internal banks, boosting bandwidth under heavy concurrency, so your Redis instance or analytics engine sustains high throughput even during peak loads. Operating at 1.35V, it cuts thermal waste and energy cost in densely packed racks—yet remains fully compliant with 1.5V slots, protecting your investment and simplifying lifecycle refreshes. These are not just technical specifications; they are the difference between a service that survives the unexpected and one that fails precisely when your business cannot afford it.

Endurance & Reliability

General Virtualization
For general virtualization hosts, balance memory capacity and cost by deploying six to eight of these 16 GB RDIMMs per server, yielding 96–128 GB total. Dual-rank x4 modules at 1600 MHz provide ample bandwidth for moderate VM density, while 1.35 V operation reduces power draw across multiple nodes. Populate all memory channels symmetrically to maintain NUMA affinity and avoid performance penalties.

In-Memory Database
In-memory databases demand maximum capacity and fault tolerance, so fully populate the server with 16 GB registered ECC modules—typically 12 or 16 DIMMs for 192–256 GB. The ECC and registered signaling safeguard data integrity under heavy write loads. Dual-rank configuration improves bank interleaving, increasing throughput for large working sets without raising latency.

High-Performance Computing (HPC)
HPC clusters require balanced throughput and density; use eight or more modules per node to fill all memory channels, achieving 128 GB+ capacity. The 1600 MHz speed and CL11 latency deliver consistent memory bandwidth for parallel MPI workloads. Low-voltage 1.35 V RDIMMs help manage thermal constraints in dense rack environments while maintaining reliable ECC protection.

Verified Compatibility

Rigorously tested, compatible with Dell PowerEdge R720/R620/T620, HP DL380p Gen8, Lenovo ThinkServer RD630, and similar servers.

FAQ

Q: Can I mix this MT36KSF2G72PZ-1G6E1HE with other memory modules of different brands or speeds?

A: Mixing RDIMMs is strongly discouraged. Even identical specs from different brands may cause signal integrity issues. The memory controller will downclock all modules to the slowest common speed, risking instability in server environments.

Q: Is this memory compatible with my system?

A: This DDR3-1600 Registered ECC module is designed for dual-socket Intel Xeon E5-2600 v1/v2 and select AMD Opteron 6300 series platforms. Verify your server board supports 1.35V low-voltage RDIMMs before ordering.

Q: What is the recommended DIMM population order for optimal performance?

A: Follow your server board's manual, typically populating identical dual-rank modules per channel starting from the farthest slot from the CPU. For dual-processor systems, balance memory equally between both CPU memory banks to avoid NUMA penalties.

Q: Does this module support overclocking or XMP profiles?

A: No. This JEDEC-standard RDIMM does not support overclocking or XMP. It operates exclusively at its programmed SPD latency of 1600MHz CL11 for data integrity. Server memory prioritizes stability over frequency manipulation.

Q: What warranty and typical failure rate can I expect?

A: This Micron module includes a 1-year warranty. Enterprise-class registered memory typically achieves an annualized failure rate (AFR) below 0.5% under normal operating conditions, far exceeding consumer-grade DRAM reliability.

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