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| Product Type | Memory Module |
|---|---|
| Memory Capacity | 16 GB |
| Memory Technology | DDR4 |
| Product Voltage | 1.2V |
| RAM Speed | 2666MHz |
| RAM Standard | DDR4-2666/PC4-21300 |
| Error Identifying | ECC |
| Signal Type | Unbuffered |
| Column Access Strobe (CAS) | CL19 |
| Rank | Dual Rank x8 |
| Quantity of Pins | 288-pin |
| RAM Genre | UDIMM |
Designed for workstations and entry-level servers that require data integrity, this 16GB DDR4-2666 UDIMM leverages unbuffered ECC to detect and correct single-bit errors, ensuring reliable operation in mission-critical applications such as engineering simulations and financial modeling. Its dual-rank x8 organization improves memory interleaving for higher sustained bandwidth, while the 1.2V low-power design and CL19 latency strike a balance between energy efficiency and responsive performance on compatible Xeon E or Ryzen PRO platforms.
1. ECC protection traps and corrects single-bit errors at runtime, eliminating silent data corruption that can crash virtualized databases or compromise financial transaction logs.
2. With 16 GB capacity per stick, it comfortably hosts multiple light containers or domain controllers, maximizing per-node consolidation ratios before memory expansion is needed.
3. Operating at 2666 MHz, it sustains 21.3 GB/s of throughput to keep in-memory indexes responsive under bursty query workloads common in mid-range application servers.
4. Dual Rank x8 organization interleaves read requests across internal ranks, raising effective bandwidth and reducing latency variance when juggling concurrent tenant VMs.
5. CL19 latency delivers a proven timing sweet spot, ensuring stable booting and consistent response across diverse server boards without manual tuning overhead in 24/7 operations.
The Micron MTA18ADF2G72AZ-2G6H1 is a DDR4-2666 ECC Unbuffered DIMM purpose-built for entry-level servers and workstations where data integrity and consistent performance are non-negotiable. In a virtualized environment running multiple lightweight VMs, the combination of 16GB capacity and dual-rank organization delivers higher effective bandwidth through rank interleaving, reducing memory access latency when multiple guests compete for resources. Meanwhile, the onboard ECC actively detects and corrects single-bit errors, which is critical in a database server that performs large in-memory sorts or caches transactional data: it prevents silent data corruption that could propagate into financial records or customer orders, averting costly downtime and audit failures. Operating at a lower 1.2V voltage, the module reduces thermal load inside dense micro-ATX server chassis, enhancing longevity and stability during 24/7 operation. For IT admins consolidating services onto a small business server, this UDIMM means reliable, responsiveness without the cost and power draw of registered memory, turning a modest tower into a trustworthy platform for both collaboration tools and mission-critical database workloads.
General Virtualization
For a typical hypervisor hosting mixed VMs, populate two identical 16GB ECC UDIMMs for a 32GB dual-channel configuration. This balances cost and memory headroom, allowing you to allocate 2–4 GB per light Linux VM or 4–8 GB per Windows guest without overcommitting. Stick to dual modules to preserve the CPU’s memory bandwidth for aggregate VM throughput, and leave two slots free for future scaling to 64GB.
In-Memory Database
In-memory engines like Redis or SAP HANA demand capacity and data integrity above speed, so maximize density while respecting the platform’s UDIMM limit. Install four of these 16GB ECC modules for a 64GB setup, ensuring dual-rank operation on all channels for optimal interleaving. If collisions or large datasets are expected, verify motherboard support and aim for a fully populated six or eight DIMM layout using identical sticks.
High-Performance Computing
HPC nodes benefit from peak memory bandwidth. Configure a balanced population across the CPU’s memory channels—often eight DIMMs in a dual-socket server or four in a single-socket workstation. Use eight 16GB ECC UDIMMs (128GB total) to saturate all channels and keep dual-rank bank parallelism. This minimizes data starvation during large-message MPI workloads or simulation checkpointing, where BW-bound access patterns dominate latency effects.
Tested and compatible with Dell PowerEdge T150, HPE ProLiant MicroServer Gen10 Plus, Lenovo ThinkSystem ST50 V2.
Q: Can I mix this MTA18ADF2G72AZ-2G6H1 with other memory modules of different brands or speeds?
A: Mixing is possible but strongly discouraged for server environments. All installed modules may downclock to the slowest speed, and ECC functionality can be compromised by mismatched ranks or timings, risking data integrity.
Q: Is this memory compatible with my Intel Xeon E or AMD EPYC server platform?
A: This DDR4-2666 ECC UDIMM is compatible with server boards that support unbuffered ECC memory, such as Intel Xeon E-2100/E-2200 series or AMD Ryzen PRO platforms. Verify motherboard QVL for dual-rank x8 modules.
Q: What is the recommended DIMM population order for optimal performance?
A: Always follow your server motherboard’s manual. Typically, populate identical dual-rank modules in symmetrical slots across all memory channels (e.g., A1 and B1 first) to maintain balanced interleaving and full ECC bandwidth.
Q: Does this module support overclocking or XMP profiles?
A: No. As a JEDEC-compliant server UDIMM, it operates strictly at DDR4-2666 CL19 1.2V. It does not support XMP or overclocking, since stability and error correction take priority over performance tuning in server environments.
Q: What warranty and typical failure rate can I expect?
A: This Micron module includes a one-year warranty. Server-grade DRAM has an extremely low AFR, typically less than 0.5% annually under specified thermal and electrical conditions, ensuring high long-term reliability.