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Micron MTA9ASF2G72AZ-3G2F1 16GB DDR4 UDIMM 3200MT/s|Reliable ECC RAM

MPN:MTA9ASF2G72AZ-3G2F1 By:Micron Warranty:1 year
US$328 - $355
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General

Product TypeMemory Module
Memory Capacity16 GB
Memory TechnologyDDR4
Product Voltage1.2 V
RAM Speed3200 MHz
RAM StandardDDR4-3200/PC4-25600
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL22
RankSingle Rank x8
Quantity of Pins288-pin
RAM GenreUDIMM

Engineer's Note

This DDR4 unbuffered ECC memory module is designed for workstations and entry-level servers where data integrity is critical. Its ECC error correction and single-rank x8 configuration deliver stable, low-latency performance ideal for file storage appliances and light virtualization workloads.

Technical Specs & Insights

1. ECC protection silently corrects single-bit errors in real time, safeguarding transactional data integrity for always-on services and reducing costly downtime.
2. Unbuffered architecture trims signal latency by eliminating register delays, delivering faster data access for latency-sensitive workloads like in-memory databases.
3. Single Rank x8 configuration minimizes electrical load on the memory controller, enabling stable operation in dense node deployments without sacrificing speed.
4. 3200 MHz transfer rate supplies elevated bandwidth per channel, helping virtualized environments sustain responsive throughput under concurrent tenant activity.
5. 16 GB capacity offers a density sweet spot for entry-level servers, allowing multiple light VMs or containers to coexist comfortably while keeping power budgets lean.

Why These Specs Matter

The MTA9ASF2G72AZ-3G2F1 is a server-grade DDR4 ECC UDIMM, purpose-built for entry-level servers and professional workstations where data integrity and resilience are non-negotiable. In a virtualized cluster running multiple VMs, silent memory corruption can cascade into catastrophic failures; this module’s ECC technology detects and corrects single-bit errors in real time, safeguarding your hypervisor and guest operating systems from unexplained crashes. For an in-memory database like Redis, where every transaction lives in RAM, the unbuffered design eliminates the extra clock cycle of registered buffers, delivering lower latency for split-second response. The single-rank x8 organization paired with a swift 3200 MHz clock pushes bandwidth to the limit, preventing memory bottlenecks when dozens of VMs compete for shared resources. Meanwhile, the 1.2 V low operating voltage dramatically reduces power consumption and heat, a critical advantage in dense rack deployments that run 24/7. Choose this module to deliver the reliability, speed, and efficiency modern virtualized and data-intensive workloads demand.

Endurance & Reliability

General Virtualization
For dense VM deployments, quantity matters more than raw bandwidth. Populate all channels symmetrically with this 16GB ECC UDIMM to maximize capacity while maintaining memory interleaving; six or eight identical modules (96–128GB total) give a typical dual-socket entry server enough headroom for 20–30 light VMs. Leave at least one DIMM slot per channel free if you anticipate growth, and always match rank and CAS across all sticks to avoid signal integrity issues.

In-Memory Database
Latency-sensitive in-memory stores like Redis or SAP HANA benefit from the low CAS latency (CL22) and single-rank design. Equip the platform with the maximum supported UDIMM count at this density—often 4×16GB or 8×16GB—to avoid oversized memory pages and keep response times predictable. The unbuffered ECC path also eliminates register delays, helping squeeze extra nanoseconds out of every query.

High-Performance Computing
HPC workloads crave memory bandwidth and data integrity, making this 3200 MT/s ECC UDIMM a solid building block. Configure all memory channels with identical single-rank 16GB modules in a one-DIMM-per-channel (1DPC) layout; that keeps speeds at the rated 3200 MHz and prevents downclocking. For mid-sized clusters, 128–256GB per node gives a sweet spot for CFD, weather modeling, and large-scale simulations where silent data corruption is unacceptable.

Verified Compatibility

Tested server-grade ECC UDIMM. Compatible with Dell PowerEdge T140/T340, HPE ProLiant ML30 Gen10, Lenovo ThinkSystem ST50.

FAQ

Q: Can I mix this MTA9ASF2G72AZ-3G2F1 with other memory modules of different brands or speeds?

A: Mixing is not recommended for servers. Different brands or speeds may cause instability or even prevent booting. For consistent ECC and performance, use identical Micron part numbers throughout the system.

Q: Is this memory compatible with my server? Which Intel or AMD platforms are supported?

A: This ECC UDIMM is designed for entry-level servers and workstations using Intel Xeon E-2300/E-2400 or AMD Ryzen PRO platforms. Verify your system board supports DDR4-3200 ECC unbuffered modules and check the manufacturer’s QVL.

Q: What is the recommended DIMM population order for optimal performance with this module?

A: Follow your motherboard manual—generally, populate the furthest slot from the CPU per channel first. For a single module, install it in slot DIMM_A1 or the blue slot as indicated. Always balance channels when adding more DIMMs.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a server-grade JEDEC-compliant ECC UDIMM running at standard DDR4-3200 with CL22. It does not support overclocking or XMP profiles, ensuring maximum reliability and data integrity for 24/7 operation.

Q: What warranty and typical failure rate can I expect from this Micron module?

A: Micron provides a 1-year warranty. Enterprise-grade components like this ECC UDIMM exhibit very low failure rates, typically below 0.1% annually, aligning with industry expectations for mission-critical server memory.

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