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Micron MTA18ADF2G72AZ-3G2R 16GB DDR4 UDIMM 3200MT/s | Low-Power SODIMM

MPN:MTA18ADF2G72AZ-3G2R By:Micron Warranty:1 year
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General

Product TypeMemory Module
Memory Capacity16 GB
Memory TechnologyDDR4
Product Voltage1.2V
RAM StandardDDR4-3200/PC4-25600
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL22
RankDual Rank x8
Quantity of Pins288-pin
RAM GenreUDIMM

Engineer's Note

This UDIMM with ECC memory module is tailored for workstations and entry-level servers where data integrity is critical, such as financial modeling or content creation with large datasets. Its dual-rank x8 organization maximizes memory bandwidth through interleaving, while the unbuffered signal type and CL22 latency ensure responsive data access at the full DDR4-3200 speed.

Technical Specs & Insights

1. ECC protection corrects single-bit errors and detects multi-bit faults in real time, preserving data integrity for transactional databases and 24/7 server operations.
2. A 16GB capacity provides ample headroom for hosting multiple lightweight containers or VMs, reducing swapping and keeping response times predictable under multi-tenant workloads.
3. DDR4-3200 delivers 25.6 GB/s peak bandwidth per channel, accelerating in-memory caching and analytics queries that demand rapid data movement.
4. Dual Rank x8 organization leverages rank interleaving to boost command efficiency, sustaining high throughput even when memory channels are heavily loaded.
5. UDIMM form factor ensures broad compatibility with cost-optimized server platforms that require ECC but do not need registered buffering, lowering total system cost without sacrificing fault tolerance.

Why These Specs Matter

The Micron MTA18ADF2G72AZ-3G2R is a 16GB DDR4-3200 Unbuffered ECC UDIMM, purpose-built for entry-level servers and workstations where data integrity meets cost-effectiveness. Its four core attributes directly address critical operational pain points. First, ECC error correction safeguards against single-bit memory errors that can silently corrupt financial records or virtual machine states—preventing costly downtime in a 24/7 database server. Second, the DDR4-3200 speed delivers 25.6 GB/s bandwidth, essential for virtualized environments where multiple VMs contend for memory, ensuring responsive applications under load. Third, the dual-rank x8 organization leverages rank interleaving to boost throughput by overlapping commands, which noticeably accelerates in-memory databases like Redis during high-concurrency queries. Finally, the 1.2V ultra-low voltage minimizes thermal stress and power draw in dense micro-server farms, reducing both cooling costs and energy bills over the hardware's lifecycle. For a branch office hypervisor or a reliable NAS, this module means stable performance round the clock—no surprises.

Endurance & Reliability

General Virtualization
For a hypervisor hosting multiple VMs, memory capacity and reliability are paramount. We recommend populating all channels symmetrically with these 16GB ECC UDIMMs to achieve balanced performance—typically six or eight modules for 96GB or 128GB totals. The ECC protection guards against in-memory errors that could compromise multiple tenants, while the dual-rank design at 3200MT/s ensures steady throughput under mixed workloads.

In-Memory Database
Latency-sensitive databases like Redis or SAP HANA benefit from wide, low-depth configurations. Install four or eight 16GB DIMMs across all memory channels to maximize bandwidth and keep CL22 latency deterministic. Avoid mixing single- and dual-rank DIMMs; stick to identical dual-rank x8 UDIMMs to prevent rank contention and maintain predictable 1.2V power draw during heavy cache eviction or in-memory analytics.

High-Performance Computing
HPC jobs such as computational fluid dynamics or genome assembly require consistent bandwidth per core. Fully load each memory channel—typically eight modules for a single-socket server—to exploit channel interleaving. With 128GB of ECC DDR4-3200, you can allocate a generous 4–8GB per core, minimizing swap. Monitor thermal headroom if running 24/7 at 1.2V, and select identical 288-pin UDIMMs to guarantee stability under sustained parallel I/O.

Verified Compatibility

Verified compatible: Dell PowerEdge T150, T350, R250; HPE ProLiant ML30 Gen10 Plus; Lenovo ThinkSystem ST50 V2.

FAQ

Q: Can I mix this MTA18ADF2G72AZ-3G2R with other memory modules of different brands or speeds?

A: Mixing this ECC UDIMM with unmatched modules is not recommended. Different brands, speeds, or ranks can compromise signal integrity and ECC functionality. Use identical Micron part numbers for validated 24/7 stability.

Q: Is this memory compatible with my system? I have an Intel Xeon E-2300 series platform.

A: Yes, it is compatible with platforms supporting unbuffered ECC DDR4, such as Intel Xeon E-2300/E-2200 series on C252/C256 chipsets. Verify 1.2V UDIMM support and 288-pin slot availability in your board's qualified vendor list.

Q: What is the recommended DIMM population order for optimal performance on a server motherboard?

A: Follow your motherboard manual. Typically, populate identical DIMMs in the same color slots per channel, starting with the farthest slot from the CPU. This enables dual-channel interleaving and full ECC capabilities without capacity imbalance.

Q: Does this module support overclocking or XMP profiles?

A: No. This DDR4-3200 ECC UDIMM operates at JEDEC standard timings (CL22) with no XMP profile. It is engineered for deterministic reliability and data integrity in server and workstation environments, not for overclocking.

Q: What warranty and typical failure rate can I expect with this module?

A: This module carries a 1-year warranty. As an enterprise‑grade Micron ECC UDIMM, it exhibits an annualized failure rate (AFR) well below 0.5%, designed for sustained 24/7 workloads.

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