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Micron MT18JDF25672PDZ-1G4F1 2GB DDR3 VLP RDIMM 1333MHz | Reliable ECC

MPN:MT18JDF25672PDZ-1G4F1 By:Micron Warranty:1 year
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General

ModelMT18JDF25672PDZ-1G4F1
Product TypeMemory Module
Compliance StandardsRoHS
Memory Capacity2 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x8
Quantity of Pins240-pin
RAM GenreVLP RDIMM

Engineer's Note

This registered ECC DDR3-1333 module, configured as a very low-profile RDIMM, is best suited for legacy server platforms handling virtualization or memory-sensitive workloads where data integrity is paramount. Its dual-rank x8 architecture improves command bus efficiency through bank interleaving, while the VLP form factor ensures seamless fitment in dense rack-mount chassis with restricted vertical clearance.

Technical Specs & Insights

1. ECC protection silently detects and corrects single-bit errors in real time, safeguarding virtualized workloads and transactional databases against silent data corruption.
2. Registered signal buffering stabilizes high-density memory configurations, allowing large-scale server deployments to maintain reliable operation under heavy memory controller loads.
3. VLP RDIMM form factor reduces vertical height for tighter DIMM spacing, improving cooling airflow in dense 1U rack servers and blade chassis without compromising ECC or buffering.
4. Dual-rank organization enables internal rank interleaving, significantly boosting sustained bandwidth and parallel access efficiency for multi-tenant hypervisor and container environments.
5. The module’s transfer rate classification aligns with power-efficient mainstream frequency, delivering steady channel throughput for cost-sensitive enterprise applications while keeping thermal overhead predictable.

Why These Specs Matter

Designed as a VLP RDIMM, the Micron MT18JDF25672PDZ-1G4F1 is engineered specifically for server environments where space and data integrity are non-negotiable. Its registered signal buffering directly addresses the instability that plagues dense virtualization clusters: when hosting dozens of virtual machines, electrical loading on the memory bus escalates rapidly. The on-board register decouples the command and address lines from the DRAM chips, enabling the server to populate all 24 DIMM slots without signal degradation, which translates into consistent VM responsiveness under heavy consolidation.

The ECC capability is equally critical for in-memory databases like Redis or SAP HANA. A single bit flip caused by cosmic radiation can silently corrupt a financial transaction or an inventory record. ECC detection and correction turns this catastrophic risk into a non-event, safeguarding data integrity around the clock. Meanwhile, the dual-rank x8 organization interleaves memory accesses to boost bandwidth, precisely what a heavy in-memory analytics workload needs to reduce latency on frequently queried datasets. Finally, the very low profile form factor fits seamlessly into 1U rack servers and blade chassis where standard-height modules simply cannot be installed, allowing you to maximize memory capacity in ultra-dense deployments without compromising cooling airflow or physical clearance.

Endurance & Reliability

General Virtualization
This 2GB DDR3-1333 VLP RDIMM is suited for older hypervisor hosts where power efficiency and moderate density matter. For a basic ESXi or Hyper‑V server, populate at least six identical modules per CPU to enable balanced memory interleaving, targeting 12–24 GB per socket. Avoid mixing ranks or speeds to maintain ECC integrity and stable guest performance.

In‑Memory Database
Low‑latency databases like Redis or Memcached benefit more from capacity than from raw speed. Since these 2GB sticks are dual‑rank x8, install them in matched sets of four or eight to fill all channels, achieving 8–16 GB per NUMA node. For production, replace with higher‑density RDIMMs when the dataset exceeds the node’s limit, but use this module for small caching layers or development replicas.

High‑Performance Computing (HPC)
In memory‑bandwidth‑bound HPC workloads, populate all memory channels with identical 2GB RDIMMs—typically six or eight per node—to maximize throughput. Registered ECC is essential for result accuracy during long simulation runs. Scale out horizontally rather than increasing per‑node capacity, or upgrade to 8GB RDIMMs if the working set demands it.

Verified Compatibility

Rigorously tested VLP RDIMM, compatible with Dell PowerEdge R710/R610, HP ProLiant DL380 G7, and similar servers.

FAQ

Q: Can I mix this MT18JDF25672PDZ-1G4F1 with other memory modules of different brands or speeds?

A: Mixing RDIMMs of different brands or speeds is not recommended. It may cause system instability or fallback to the lowest common frequency, compromising server reliability.

Q: Is this memory compatible with my system? (Intel/AMD server platforms)

A: This 2GB DDR3-1333 Registered ECC VLP RDIMM is compatible with Intel Xeon 3400/5500/5600 series and AMD Opteron 4100/6100 platforms that support 240-pin DDR3 registered memory.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical modules per channel, starting with the slots furthest from the CPU. Consult your server board manual for balanced interleaving to maximize memory bandwidth and ECC functionality.

Q: Does this module support overclocking or XMP profiles?

A: No. As a JEDEC-compliant server registered DIMM, it operates only at standard DDR3-1333 timings (CL9). Overclocking and XMP are not supported for maintaining data integrity.

Q: What warranty and typical failure rate can I expect?

A: This Micron module includes a 1-year warranty. Enterprise-grade RDIMMs exhibit very low failure rates under proper conditions, with typical MTBF far exceeding consumer memory.

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