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| Product Type | Memory Module |
|---|---|
| Compliance Standards | RoHS |
| Memory Capacity | 2 GB |
| Memory Technology | DDR3 |
| RAM Speed | 1600 |
| RAM Standard | DDR3-1600/PC3-12800 |
| Error Identifying | Non-ECC |
| Signal Type | Unbuffered |
| Column Access Strobe (CAS) | CL11 |
| Rank | Single Rank x16 |
| Quantity of Pins | 204-pin |
| RAM Genre | SoDIMM |
This SoDIMM module is engineered for notebook and small-form-factor platforms, delivering a straightforward memory upgrade with its DDR3-1600 speed and single-rank x16 organization that balances density and thermal efficiency. The unbuffered, non-ECC design and CL11 latency make it an ideal plug-and-play solution for mobile workstations and consumer laptops that prioritize low power consumption and broad compatibility over data-critical error correction.
1. SoDIMM form factor enables a straightforward, tool-free upgrade in compact notebook chassis, ensuring even non-technical users can easily boost system responsiveness.
2. 204-pin edge connector guarantees broad compatibility with mainstream laptop platforms, delivering a true plug-and-play experience without BIOS tweaks.
3. DDR3 technology strikes an optimal balance between adequate throughput and low power draw, helping extend the usable life of legacy portable systems.
4. 1600 MT/s transfer rate sustains smooth multitasking for everyday productivity and HD media streaming, preventing sluggishness under typical office workloads.
5. Single Rank x16 organization minimizes the electrical load on the memory controller, which directly reduces battery drain and keeps chassis temperatures comfortably low during extended mobile use.
Based on its 204-pin SODIMM form factor, the Micron MT4KTF25664HZ-1G6E2 is unmistakably a notebook memory module, and its four defining characteristics address the real constraints faced when upgrading or maintaining portable systems. The compact SODIMM design ensures direct drop-in compatibility with ultrabooks and small-form-factor mobile workstations, eliminating clearance issues and making physical installation effortless even in tightly packed chassis. Its DDR3-1600 speed and CL11 latency strike a critical balance for battery-powered environments: you get the responsive multitasking needed for running virtual meetings alongside large spreadsheets, while the single-rank x16 organization reduces the electrical load on the memory controller. This translates directly into lower power draw and cooler operation, extending precious battery life during long flights or back-to-back client sessions. Being unbuffered and non-ECC, the module keeps latencies minimal for smooth application launches in point-of-sale terminals and digital signage boards, and its RoHS compliance guarantees safe, environmentally responsible deployment in education or healthcare settings where hardware longevity matters. For anyone reviving an aging thin-and-light, this 2 GB stick delivers the energy efficiency, easy snap-in upgrade path, and dependable everyday performance that turns a sluggish device back into a reliable productivity tool.
Given the 204-pin SoDIMM, Non-ECC, and unbuffered specifications, this is laptop memory. Capacity planning guidelines:
Laptop Upgrade
Adding a second identical module creates a 4GB dual-channel configuration that noticeably improves system responsiveness and integrated graphics performance. For a more substantial lift, replace both with a 2x4GB or 2x8GB DDR3-1600 SoDIMM kit (PC3-12800, CL11), ensuring the laptop’s BIOS supports the increased density.
Mobile Workstation
Fill both SO-DIMM slots with the largest supported DIMMs—often 8GB each for a total of 16GB—to handle CAD, VMs, or large data sets. Choose matched unbuffered modules that meet the same speed grade and CAS latency to avoid compatibility issues under heavy sustained loads.
Ultrabook Power Saving
If the platform supports it, switch to low-voltage DDR3L-1600 (PC3L-12800) modules operating at 1.35V instead of 1.5V. A dual-channel 2x4GB or 2x8GB DDR3L kit reduces power draw and heat, prolonging battery life while delivering ample memory for daily tasks. Verify CPU compatibility before mixing voltages.
Rigorously tested, guaranteed compatible with laptops: Dell Latitude E6430, Lenovo ThinkPad T430, HP EliteBook 2570p.
Q: Can I mix this MT4KTF25664HZ-1G6E2 with other memory modules of different brands or speeds?
A: Mixing is not recommended. Even if the system boots, mismatched timings or ranks may cause instability. For reliable operation, use identical modules with matching part numbers, speed, and CAS latency.
Q: Is this memory compatible with my laptop?
A: This is a DDR3-1600 SoDIMM for notebooks. Verify your laptop supports 204-pin DDR3 SoDIMMs and a 2 GB single-rank module. Consult your model’s specifications or memory QVL to confirm compatibility.
Q: What is the recommended DIMM population order for optimal performance?
A: For single-module installations, use the primary slot as defined by the laptop manufacturer. Adding a second identical 2 GB module enables dual-channel mode, improving bandwidth when slots are populated symmetrically.
Q: Does this module support overclocking or XMP profiles?
A: No, this is a standard JEDEC-compliant DDR3-1600 SoDIMM with fixed CL11 timings. It does not include XMP profiles. The module operates at its rated speed and cannot be manually overclocked in most laptops.
Q: What warranty and typical failure rate can I expect?
A: This module carries a one-year warranty. Typical AFR (annualized failure rate) is well below 0.5% under normal conditions. Premature failures are rare and covered by the warranty for a replacement.