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Micron MT18KSF51272PZ-1G4D1DG 4GB DDR3 RDIMM 1333MT/s|Registered ECC

MPN:MT18KSF51272PZ-1G4D1DG By:Micron Warranty:1 year
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General

Product TypeMemory Module
Compliance StandardsRoHS
Memory Capacity4 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankSingle Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

This DDR3-1333 registered ECC module with 1.35V operation is engineered for server-class systems running virtualization and memory-intensive database workloads, where end-to-end data integrity is critical. Its single-rank x4 organization and registered signal architecture reduce electrical loading for stable multi-DIMM configurations, while ECC detection and correction safeguard against single-bit errors in sustained, mission-critical operation.

Technical Specs & Insights

1. Registered DIMM architecture buffers command and address signals, preserving signal integrity across densely populated server motherboards to support large memory capacities in virtualization clusters.
2. ECC protection continuously detects and corrects single-bit memory errors, safeguarding transactional database integrity during 24/7 operation.
3. 1.35V low-voltage operation reduces power draw and cooling overhead in rack-dense data centers, directly lowering total cost of ownership per node.
4. Single Rank x4 organization ensures uniform electrical loading and consistent access latency, which stabilizes performance for latency-sensitive enterprise workloads under mixed load.
5. DDR3-1333 bandwidth delivers a reliable throughput baseline for legacy ERP and file-serving roles, where steady data flow matters more than peak benchmarks.

Why These Specs Matter

The MT18KSF51272PZ-1G4D1DG is a DDR3L-1333 registered ECC memory module built specifically for server-class reliability. Its combination of error-correcting code and register buffering directly addresses the silent-data-corruption risks that plague dense virtualization clusters. When a hypervisor manages dozens of VMs, a single cosmic-ray-induced bit flip can crash a guest or corrupt a transaction log. ECC detects and corrects those errors in real time, while the register chip isolates the memory bus electrical loading so you can fully populate all 24 DIMM slots on a dual-socket board without signal collapse—meaning you scale VM density safely.

For in-memory databases like Redis or SAP HANA, the single-rank x4 organization and CL9 latency deliver predictable low-latency random access, reducing store-forward delays on every key lookup. Meanwhile, the 1.35V low-voltage design cuts per-module power by roughly 15% versus standard 1.5V DDR3. In a rack of hundreds of nodes running 24/7 financial analytics, that thermal and wattage saving compounds directly into lower cooling costs and higher rack power headroom, letting you pack more compute into the same footprint without sacrificing data integrity or uptime.

Endurance & Reliability

This 4GB DDR3L-1333 registered ECC RDIMM (1.35V, CL9, single-rank x4) is a server memory module. It suits environments that demand reliability and power efficiency. Proper capacity planning relies on populating memory channels symmetrically with identical modules.

General Virtualization
Populate four modules (16 GB) per processor across all memory channels for effective interleaving. For greater VM density, use eight modules (32 GB) while maintaining balanced DIMM-per-channel ratios. ECC guards against soft errors in multi-tenant environments.

In-Memory Database
Deploy eight to twelve identical modules (32–48 GB) per CPU, filling all channels to boost bandwidth. Use memory mirroring with an equal number of spare modules to provide fault tolerance. The low 1.35V supply reduces power consumption, and ECC ensures data integrity under constant read/write loads.

High Performance Computing (HPC)
Install one DIMM per channel (four to six modules per socket) to achieve maximum bandwidth with minimal latency. Keep all node configurations identical; even slight rank mismatches hurt scalability. The registered low-voltage design stabilizes 1333MHz operation in dense clusters, lowering total power draw.

Verified Compatibility

Compatibility-tested server memory: rigorously verified for Dell PowerEdge R710/R720, HP ProLiant DL380p Gen8, and similar DDR3 systems.

FAQ

Q: Can I mix this MT18KSF51272PZ-1G4D1DG with other memory modules of different brands or speeds?

A: Mixing Registered ECC modules is not recommended. Different brands, speeds, or ranks can cause signal integrity issues and system instability in server environments. Always populate with identical Micron-certified DIMMs for reliable 24/7 operation.

Q: Is this memory compatible with my server? Which Intel or AMD platforms are supported?

A: This DDR3-1333 Registered ECC RDIMM is compatible with servers using Intel Xeon E5/E5-v2 or AMD Opteron 6300/4300 series platforms. Verify your board requires 1.35V low-voltage RDIMMs with 240-pin sockets and supports 4GB single-rank x4 modules.

Q: What is the recommended DIMM population order for optimal performance with this module?

A: Populate identical modules starting with the DIMM slots farthest from each processor, typically slots A1, B1 per channel first. Always balance memory across channels and follow your server motherboard's silkscreen population guide to maintain interleaved ECC performance.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a server-grade Registered ECC DIMM designed for strict JEDEC compliance at DDR3-1333 CL9. It does not support overclocking or XMP; stability and data integrity are prioritized over frequency adjustments in enterprise platforms.

Q: What warranty and typical failure rate can I expect with this memory?

A: This Micron module includes a 1-year warranty. With a factory MTBF rating typical for enterprise RDIMMs, AFR is extremely low under standard operating conditions, ensuring high reliability for mission-critical server applications.

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