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Micron MT18KSF51272AZ-1G6K1ZE 4GB DDR3 UDIMM 1600|Reliable ECC Memory

MPN:MT18KSF51272AZ-1G6K1ZE By:Micron Warranty:1 year
US$65 - $70
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General

Product TypeMemory Module
Compliance StandardsRoHS
Memory Capacity4 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1600MHz
RAM StandardDDR3-1600/PC3-12800
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL11
RankDual Rank x8
Quantity of Pins240-pin
RAM GenreUDIMM

Engineer's Note

This dual-rank x8 unbuffered ECC UDIMM module is purpose-built for entry-level servers and workstations executing data-critical workloads, where error correction ensures uncompromised data integrity. Its DDR3L 1.35V low-voltage operation and CL11 latency provide a reliable, energy-efficient foundation for memory-intensive applications such as virtualization and in-memory databases.

Technical Specs & Insights

1. Error correction code detects and corrects single-bit memory errors, preventing silent data corruption in critical server workloads.
2. Dual-rank organization increases bank-level parallelism, sustaining higher bandwidth utilization for virtualized environments.
3. Low-voltage operation reduces power consumption and thermal stress, improving long-term reliability in dense rack deployments.
4. Unbuffered design eliminates register latency, offering lower access times suited for microservers and entry-level compute nodes.
5. A 4 GB capacity is optimized for lightweight dedicated tasks such as firewall appliances or small-scale data caching, ensuring cost-effective provisioning.

Why These Specs Matter

For server environments where uptime and accuracy are non-negotiable, the MT18KSF51272AZ-1G6K1ZE UDIMM ECC DDR3L module brings four critical characteristics together to solve genuine operational pain points. ECC error correction acts as a silent guardian, automatically detecting and repairing single-bit errors that, if left unchecked, could silently corrupt a hypervisor and bring down an entire virtualized cluster of guest machines. The dual-rank x8 organization enables rank interleaving, which increases effective memory bandwidth; this becomes especially vital when an in-memory database like Redis handles thousands of concurrent transactions—without it, memory access storms translate directly into sluggish response times and lost business. Operating at just 1.35V, the module trims power draw and heat generation in always-on deployments, cutting cooling costs and reducing the risk of thermal throttling inside dense rack cabinets. Meanwhile, its unbuffered design strips away the extra latency of registered memory, delivering the split-second responsiveness a Type-1 hypervisor demands when juggling I/O-heavy workloads. For a small-to-midsize business running virtualized applications around the clock, these features mean fewer outages, lower energy bills, and predictable performance under real-world loads.

Endurance & Reliability

General Virtualization
Populate two channels with four 4 GB ECC UDIMMs (16 GB total) for a small virtualization lab running a few VMs. For production, install eight modules (32 GB) across all memory channels to handle moderate VM density without memory pressure. Always use matched dual-rank x8 DIMMs to preserve dual-channel performance and reliability.

In-Memory Database
To keep datasets fully in RAM, maximize capacity by filling every slot on the motherboard. Typical single-socket UDIMM platforms support up to 32 GB using eight of these modules; for heavier instances, seek boards with 16 slots to reach 64 GB. ECC ensures data integrity essential for transactional databases.

High-Performance Computing
HPC jobs demand sustained bandwidth and error correction. Install identical 4 GB UDIMMs in all memory channels—at least four modules for 16 GB dual-channel—scaling to 32 GB for memory-bound workloads. ECC prevents silent data corruption during computations, and populating every channel avoids bandwidth bottlenecks.

Verified Compatibility

This server memory has passed rigorous testing, compatible with Dell PowerEdge T20, R220, HPE MicroServer Gen8, Lenovo TS140.

FAQ

Q: Can I mix this MT18KSF51272AZ-1G6K1ZE with other memory modules of different brands or speeds?

A: Mixing modules is not recommended for server environments. It may cause instability, require speed downgrades, or disable ECC functionality. Always use identical modules for validated reliability and performance.

Q: Is this memory compatible with my Intel Xeon E3 or AMD server platform?

A: Yes, if your board supports DDR3 ECC UDIMMs at 1.35V. Compatible platforms include Intel Xeon E3 v2/v3 and select AMD AM3+ server chipsets. Verify CPU and motherboard ECC support before purchase.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical modules per channel, starting with the slot furthest from the CPU. Follow your server board’s manual for dual-channel pairs—typically blue slots first—to enable full memory bandwidth and ECC parity.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a JEDEC-standard server DDR3L module designed for 1600MHz at CL11. It does not include XMP nor support overclocking. Stability and data integrity are prioritized over variable speeds.

Q: What warranty and typical failure rate can I expect?

A: This Micron module comes with a 1-year warranty. Typical annualized failure rate (AFR) for enterprise-grade ECC UDIMMs is well under 0.5% under normal operating conditions, ensuring excellent long-term reliability.

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