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Micron MT36JSZF51272PY-1G1D1AB 4GB DDR3 RDIMM 1066MT/s Reliable ECC

MPN:MT36JSZF51272PY-1G1D1AB By:Micron Warranty:1 year
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General

Product TypeMemory Module
Compliance StandardsRoHS
Memory Capacity4 GB
Memory TechnologyDDR3
Product Voltage1.5V
RAM Speed1066MHz
RAM StandardDDR3-1066/PC3-8500
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL7
RankDual Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

This DDR3-1066 Registered ECC RDIMM is engineered for legacy server platforms handling memory-intensive workloads like virtualization and in-memory databases, where its dual-rank x4 configuration and ECC ensure robust data integrity under sustained load. The registered signal type stabilizes multi-DIMM channels at maximum capacity, while the CL7 latency delivers responsive performance for critical enterprise applications.

Technical Specs & Insights

1. ECC protection continuously detects and corrects single-bit errors, preserving data integrity for financial transactions and database operations where even silent corruption is unacceptable.
2. Registered signal buffering stabilizes high-density memory configurations, allowing the server to scale up capacity without compromising command signal integrity across fully populated banks.
3. Dual Rank x4 organization interleaves memory accesses across two internal ranks, boosting effective bandwidth and reducing idle cycles in virtualized environments running multiple tenants.
4. 4 GB module capacity provides a balanced memory footprint for lightweight hypervisor nodes or dedicated appliance workloads, keeping cost and thermal overhead in check.
5. 1066 MHz transfer speed delivers dependable baseline throughput for legacy enterprise applications, ensuring steady performance in environments where stability outweighs peak frequency demands.

Why These Specs Matter

The MT36JSZF51272PY-1G1D1AB is a server-class DDR3 Registered DIMM, engineered for environments where failure is not an option. Its ECC technology continuously detects and corrects single-bit errors — a silent bit flip in a virtualization cluster could corrupt a hypervisor state and cascade into VM failures, but with ECC your consolidation platform maintains rock-solid integrity. The registered signal buffer decouples the memory controller from the electrical load of multiple modules, so when you fully populate a server for a large in-memory database or dense virtual desktop infrastructure, stable 4 GB density per DIMM scales reliably without signal degradation. Dual rank x4 organization interleaves access across two internal ranks, effectively boosting bandwidth for transaction-heavy applications like an in-memory Redis cache, where every nanosecond of latency counts. With a CAS latency of just 7 cycles at 1066 MHz, data retrieval is crisp, reducing CPU stall time during peak query loads. Together, these features transform a simple 4 GB module into a critical asset for data integrity, scalable capacity, and responsive performance in any 24/7 enterprise server.

Endurance & Reliability

General Virtualization
For a moderate virtualization host running multiple light VMs, install six to eight 4 GB RDIMMs (24–32 GB total) in a balanced multi-channel configuration. This capacity comfortably supports memory overcommitment with common hypervisors, while registered ECC protects guest uptime against single-bit errors. Avoid single-channel setups, as dual- or triple-channel interleaving compensates for the 1066 MT/s speed under concurrent I/O loads.

In-Memory Database
In-memory databases like Redis or SAP HANA demand capacity and reliability over raw bandwidth. Populate all available DIMM slots with 4 GB RDIMMs to reach the highest possible memory footprint—often 64 GB or more on dual-socket platforms—while relying on dual-rank x4 modules for rank-interleaving benefits. ECC and registered signaling are non-negotiable here, ensuring data integrity during large, long-running datasets that exceed cache.

High-Performance Computing (HPC)
For memory-bandwidth-sensitive HPC nodes, install an equal number of DIMMs per memory channel (e.g., six or twelve modules on a triple-channel Nehalem/Westmere platform) to maximize interleaving and throughput. Though 4 GB density is small per module, populating all channels with dual-rank RDIMMs can sustain reasonable bandwidth for MPI workloads, while ECC guards multi-day simulation runs. Use identical part numbers to prevent training mismatches and NUMA imbalances.

Verified Compatibility

Rigorously tested server memory, compatible with Dell PowerEdge R710, HP ProLiant DL380 G7, and IBM System x3650 M3.

FAQ

Q: Can I mix this MT36JSZF51272PY-1G1D1AB with other memory modules of different brands or speeds?

A: Mixing RDIMMs with different brands, speeds, or ranks risks signal integrity issues. For server reliability, we strictly advise using identical modules—same part number, speed, and rank—to prevent POST failures and instability.

Q: Is this memory compatible with my system?

A: This is a 4GB DDR3-1066 Registered ECC RDIMM. It requires a server platform supporting 240-pin DDR3 Registered DIMMs, typically Intel Xeon 5500/5600 series or AMD Opteron 6100/6200 series with matching chipset, not standard desktops.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate identical Dual Rank x4 RDIMMs per channel starting with the slot farthest from the CPU. For dual-processor servers, balance memory evenly across CPUs and populate three DIMMs per channel for triple-channel when available.

Q: Does this module support overclocking or XMP profiles?

A: No. This is an enterprise-grade Registered ECC memory operating at JEDEC-standard DDR3-1066 with CL7. It lacks XMP support and is not designed for overclocking; stability and data integrity take priority over clock speed adjustments.

Q: What warranty and typical failure rate can I expect?

A: This module carries a 1-year warranty covering manufacturing defects. Its ECC and registered architecture yields extremely low failure rates, typically under 0.1% annually in normal server environments with proper cooling.

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