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Micron MT36KSZF1G72PZ-1G4D1AF 8GB DDR3 RDIMM 1333MT/s | Reliable ECC

MPN:MT36KSZF1G72PZ-1G4D1AF By:Micron Warranty:1 year
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General

Product TypeMemory Module
Compliance StandardsRoHS
Memory Capacity8 GB
Memory TechnologyDDR3
Product Voltage1.35V
RAM Speed1333MHz
RAM StandardDDR3-1333/PC3-10600
Error IdentifyingECC
Signal TypeRegistered
Column Access Strobe (CAS)CL9
RankDual Rank x4
Quantity of Pins240-pin
RAM GenreRDIMM

Engineer's Note

Designed for legacy servers and enterprise virtualization platforms, this 8GB DDR3-1333 Registered ECC module integrates dual-rank x4 organization and a low 1.35V operating voltage to deliver reliable data integrity and reduced power consumption. Its registered signal architecture and CL9 latency ensure stable operation under heavy memory database workloads where multi-DIMM configurations demand robust signal integrity.

Technical Specs & Insights

1. Error-correcting code memory detects and repairs single-bit errors in real time, safeguarding transactional data integrity in financial and database servers.
2. Registered buffering decouples the memory controller from DRAM loads, allowing dense DIMM populations essential for large-scale virtualization hosts.
3. Dual-rank organization interleaves memory bank accesses, sustaining peak channel utilization when multiple virtual machines compete for bandwidth.
4. The module’s modest capacity per slot strikes a cost-effective balance for general-purpose enterprise workloads, avoiding stranded resources in scale-out deployments.
5. Low-voltage operation cuts overall rack power consumption and cooling overhead, directly lowering total cost of ownership in always-on data centers.

Why These Specs Matter

This 8GB DDR3L-1333 RDIMM (MT36KSZF1G72PZ-1G4D1AF) is purpose-built for servers, where ECC, registered buffering, low voltage, and dual-rank design directly impact uptime, capacity, power, and performance. ECC corrects single-bit errors in real time—in a dense virtualization cluster, it prevents a silent bit flip from crashing a hypervisor and taking dozens of VMs offline. The registered clock driver buffers address and command signals, enabling you to fill all DIMM slots with confidence; when those VMs require 256GB or more per node, signal integrity remains rock-solid. Operating at 1.35V instead of 1.5V slashes power draw and cooling overhead across every rack, materially reducing OpEx. Finally, the dual-rank x4 organization uses interleaving to maximize bandwidth, which directly accelerates in-memory databases like Redis—higher queries per second and lower latency keep your real-time analytics responsive under peak load. These four attributes together transform a simple memory stick into a cornerstone of resilient, energy-smart infrastructure.

Endurance & Reliability

General Virtualization
For a typical hypervisor hosting multiple VMs, density and reliability are key. Given these 8 GB DDR3L-1333 RDIMMs, populate at least six modules (48 GB total) across triple-channel memory architectures to balance capacity and memory bandwidth. Always install identical DIMMs in matched sets to maintain ECC protection and stable performance under mixed workloads.

In-Memory Database
In-memory databases demand both capacity and low latency. Using these dual-rank x4 ECC RDIMMs, deploy twelve or more modules to reach 96–192 GB, placing them across all memory channels to maximize throughput. The registered buffering permits high-density configurations essential for large datasets while the 1.35 V operation reduces power and cooling costs in 24/7 environments.

High-Performance Computing
HPC clusters benefit from consistent latency and error resilience. Configure nodes with eight or sixteen of these 8 GB RDIMMs for 64–128 GB per node, populating all channels symmetrically to avoid performance penalties. The CL9 latency and 1333 MHz speed provide a predictable baseline; dual-rank x4 organization improves bank-level parallelism, helping memory-intensive scientific workloads scale efficiently.

Verified Compatibility

This rigorously tested server memory is compatible with Dell PowerEdge R720, HP ProLiant DL380p Gen8, and more.

FAQ

Q: Can I mix this MT36KSZF1G72PZ-1G4D1AF with other memory modules of different brands or speeds?

A: Mixing different brands or speeds is not recommended for Registered ECC memory. Mismatched modules can cause signal integrity issues and system instability on server platforms. Always use identical part numbers for guaranteed compatibility.

Q: Is this memory compatible with my server system?

A: This 240-pin DDR3-1333 Registered ECC RDIMM is designed for dual-socket Intel Xeon E5-2400 series or similar AMD Opteron platforms. Verify your server board’s Qualified Vendor List to ensure proper support for dual-rank x4 modules.

Q: What is the recommended DIMM population order for optimal performance?

A: Populate corresponding slots across memory channels starting from the first slot of each channel. For dual-processor boards, balance identical DIMMs between CPU1 and CPU2 channels. Always refer to your server's manual for slot numbering.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a server-grade Registered DIMM adhering strictly to JEDEC DDR3-1333 CL9 specifications. It does not support overclocking or XMP profiles, as reliability and data integrity are prioritized over speed in enterprise environments.

Q: What warranty and typical failure rate can I expect?

A: This module comes with a 1-year warranty. Our RDIMMs undergo rigorous screening and burn-in testing to deliver an AFR below 0.5% under typical operating conditions, ensuring high MTBF and long-term reliability for critical workloads.

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