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Micron MTA9ASF1G72AZ-3G2E2 8GB DDR4 UDIMM 3200MT/s|Reliable ECC Memory

MPN:MTA9ASF1G72AZ-3G2E2 By:Micron Warranty:1 year
US$772 - $837
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General

Product TypeMemory Module
Memory Capacity8 GB
Memory TechnologyDDR4
Product Voltage1.2V
RAM Speed3200MHz
RAM StandardDDR4-3200/PC4-25600
Error IdentifyingECC
Signal TypeUnbuffered
Column Access Strobe (CAS)CL22
RankSingle Rank x8
Quantity of Pins288-pin
RAM GenreUDIMM

Engineer's Note

Targeted at entry-level servers and workstations, this Micron 8GB DDR4-3200 UDIMM with ECC ensures data integrity for virtualization and in-memory database workloads where reliability is paramount. Its single-rank x8 organization and unbuffered signal topology deliver low latency (CL22) and stable operation at 1.2V, making it an ideal fit for platforms like Intel Xeon E-2300 or AMD Ryzen Pro that require ECC without registered buffering.

Technical Specs & Insights

1. ECC protection detects and corrects single-bit errors in real time, preserving data accuracy for virtualization hosts and mission-critical databases where silent corruption is unacceptable.

2. The module’s capacity supports dense memory configurations in entry-level servers, enabling more virtual machines or containers per node without immediately requiring larger DIMMs.

3. High-speed DDR4 operation delivers ample memory bandwidth for concurrent workloads, reducing latency in in-memory analytics and improving response times under multi-tenant environments.

4. Low operating voltage reduces overall power consumption and thermal load in rack-mounted deployments, helping data centers lower cooling costs and improve energy efficiency.

5. Single-rank x8 architecture ensures stable signal integrity and minimal electrical loading on the memory bus, which is essential for maintaining reliability in always-on server applications.

Why These Specs Matter

This Micron 8GB DDR4-3200 UDIMM (MTA9ASF1G72AZ-3G2E2) is purpose-built for entry-level servers, workstations, and storage appliances where every bit of data integrity and every nanosecond of latency directly impact your operation. Consider a virtualization cluster running multiple VMs: a single undetected bit-flip in memory can corrupt guest states or silently propagate errors into your databases. The on-die ECC instantly corrects single-bit errors, preventing such silent data corruption and keeping your services trustworthy around the clock. Meanwhile, the unbuffered design eliminates the register delay found in RDIMMs, giving memory-access-latency-sensitive workloads like Redis or in-memory OLAP a tangible latency advantage. Coupled with a 3200MT/s transfer rate, this module feeds modern Xeon E or AMD Ryzen PRO platforms the bandwidth needed to accelerate database lookups or real-time analytics without stalling. Its single-rank x8 organization presents a lighter electrical load to the memory controller, which means you can populate multiple DIMMs per channel while preserving signal integrity and stable rank interleaving. In practice, that translates to a virtualization host that can support more VMs without unexpected crashes, and a memory database that responds faster under heavy concurrency, all while protecting your data from invisible threats.

Endurance & Reliability

Given the module is an 8GB DDR4-3200 ECC Unbuffered DIMM (288-pin, single-rank x8), it is designed for entry-level servers and workstations where data integrity matters. Below is capacity planning guidance for common server workloads.

General Virtualization
Populate all memory channels symmetrically to enable multi-channel interleaving. For a quad-channel platform, install four identical 8GB modules (32GB total) to balance a modest number of VMs. If consolidation demands increase, fill the second DIMM slot per channel with another matching set, yielding 64GB while preserving balanced memory access.

In-Memory Database
Favor maximum capacity to keep the working set entirely in RAM. Use these 8GB UDIMMs in all available slots—many single-socket boards support up to 128GB across sixteen slots. This reduces storage I/O dramatically, though populating two DIMMs per channel may downclock the memory; the capacity gain usually outweighs the slight speed trade-off.

High-Performance Computing
Sustain peak bandwidth by installing only one DIMM per channel, allowing the full 3200 MT/s speed. An eight-channel system with eight 8GB modules delivers 64GB at optimal throughput. If larger memory footprints are needed, replace modules with higher-capacity DIMMs rather than adding a second DIMM per channel to avoid bandwidth degradation.

Verified Compatibility

Tested ECC UDIMM, compatible with Dell PowerEdge R240/T140 and HPE ProLiant DL20 Gen10.

FAQ

Q: Can I mix this MTA9ASF1G72AZ-3G2E2 with other memory modules of different brands or speeds?

A: Mixing with dissimilar modules is strongly discouraged. ECC UDIMMs require matching ranks, timings, and organization to maintain data integrity. Mismatched DIMMs may force the system to disable ECC or fail to boot.

Q: Is this memory compatible with my system?

A: It is compatible with servers and workstations using Intel Xeon E-2100/E-2200 series or AMD AM4 platforms that explicitly support DDR4 ECC unbuffered modules. Verify your board’s QVL for ECC UDIMM support.

Q: What is the recommended DIMM population order for optimal performance?

A: Follow your server board manual. Generally, populate the slots farthest from the CPU per channel first. For single-rank x8 ECC UDIMMs, installing one DIMM per channel typically yields the best electrical signaling and performance.

Q: Does this module support overclocking or XMP profiles?

A: No. This is a JEDEC-compliant, server-grade ECC UDIMM. It operates strictly at DDR4-3200 CL22 under 1.2 V and does not support XMP or overclocking, ensuring utmost stability for critical workloads.

Q: What warranty and typical failure rate can I expect?

A: This module is covered by a 1-year warranty. As a Micron enterprise memory product built with strictly screened DRAM, the AFR (annualized failure rate) is exceptionally low, typically well under 0.5% under normal operating conditions.

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