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| Model | MT18KSF1G72AZ-1G4E1ZF |
|---|---|
| Product Type | Memory Module |
| Compliance Standards | RoHS |
| Memory Capacity | 8 GB |
| Memory Technology | DDR3 |
| Product Voltage | 1.35V |
| RAM Speed | 1333MHz |
| RAM Standard | DDR3-1333/PC3-10600 |
| Error Identifying | ECC |
| Signal Type | Unbuffered |
| Column Access Strobe (CAS) | CL9 |
| Rank | Dual Rank x8 |
| Quantity of Pins | 240-pin |
| RAM Genre | UDIMM |
This unbuffered ECC DDR3 module with its dual-rank x8 organization is best suited for entry-level servers and workstations running virtualization or memory-sensitive database workloads, where ECC corrects single-bit errors to maintain data integrity. The 1.35V low-voltage operation and CL9 latency enhance power efficiency and responsiveness in always-on systems while the 240-pin UDIMM form factor ensures compatibility with Intel Xeon E3 and similar platforms.
1. ECC protection silently corrects single-bit memory errors, safeguarding transactional integrity for critical server workloads like database hosting and authentication services.
2. Low-voltage operation curbs power draw and thermal build-up, enabling denser rack configurations while reducing lifetime cooling expenses in always-on data centers.
3. Sufficient base capacity supports an entire lightweight hypervisor or container host footprint, keeping dedicated memory pools fully accessible for guest workloads without overprovisioning.
4. Dual-rank x8 organization enables rank interleaving, maximizing memory-level parallelism to feed multi-core server CPUs efficiently during high-concurrency file and print services.
5. CL9 latency delivers consistent access response times, ensuring snappy data retrieval for latency-sensitive enterprise applications running on cost-optimized server platforms.
The Micron MT18KSF1G72AZ-1G4E1ZF is a DDR3-1333 ECC unbuffered DIMM purpose-built for reliability-sensitive servers and workstations. Its four defining attributes solve real operational pain points. ECC instantly corrects single-bit errors: in a virtualized cluster, one bit-flip can silently corrupt multiple guest VMs, but ECC preserves data fidelity and prevents the kind of silent data corruption that triggers random instability. The 1.35V low-voltage operation reduces both power draw and heat, directly lowering electricity and cooling expenses for always-on systems. Dual-rank x8 organization leverages rank interleaving to improve bandwidth efficiency, a critical advantage for in-memory databases such as Redis where sub-millisecond access to hot datasets eliminates bottlenecks under heavy concurrent queries. Finally, the unbuffered UDIMM format eliminates buffer latency, delivering lower command-to-response timing for single-processor platforms without the cost of registered memory. For SMB virtualization hosts or high-availability caching nodes, this module provides the ideal balance of data integrity, energy efficiency, and responsive performance, ensuring your essential applications run uninterrupted.
General Virtualization
For a virtualization host using DDR3 ECC UDIMMs, populate all available channels symmetrically to maximize memory bandwidth while retaining ECC protection. A typical dual‑socket entry server with six DIMM slots per CPU would benefit from six of these 8 GB modules (48 GB total), allowing balanced distribution of moderate‑density VMs. Avoid mixing non‑ECC modules, as ECC is essential for data integrity in multi‑tenant environments.
In-Memory Database
In‑memory databases demand the largest possible capacity and fault tolerance. Populate every DIMM slot with this 8 GB ECC UDIMM to reach the platform’s maximum—commonly 64 GB or 128 GB on single‑socket UDIMM‑limited servers. Because the module is dual‑rank x8, it provides good signal integrity when all channels are filled, but always verify rank‑per‑channel limits with the server vendor to prevent performance degradation under heavy write loads.
High-Performance Computing (HPC)
HPC clusters often deploy many low‑cost nodes where ECC UDIMMs like this 1.35 V module reduce power and cooling overhead. Configure each node with at least four identical modules (32 GB) in a balanced quad‑channel arrangement to feed compute‑bound MPI tasks. For memory‑bandwidth‑sensitive workloads, add a second matched set to reach 64 GB while maintaining symmetrical interleaving; the dual‑rank design helps sustain bandwidth when all slots are occupied.
Rigorously tested server memory, compatible with Dell PowerEdge R210 II, T110 II, HP ML310e Gen8, Lenovo TS140.
Q: Can I mix this MT18KSF1G72AZ-1G4E1ZF with other memory modules of different brands or speeds?
A: Mixing is not recommended. Mismatched brands, speeds, or ranks may cause instability, especially in ECC server environments. For data integrity, use identical modules with matching latency and voltage specifications.
Q: Is this memory compatible with my Intel Xeon E3 or AMD Ryzen Pro server platform?
A: This unbuffered ECC UDIMM is designed for platforms with DDR3 ECC support, such as Intel Xeon E3-1200 v2/v3 series or AMD AM3+ Opteron. Verify your motherboard's QVL and chipset support for 1.35V ECC modules.
Q: What is the recommended DIMM population order for optimal performance in a dual-socket server?
A: Populate identical DIMMs in matched channels, starting with the primary channel farthest from each CPU. Follow your system board's slot numbering (e.g., A1, B1 first). This dual-rank module benefits from balanced channel loading.
Q: Does this DDR3 ECC module support overclocking or XMP profiles?
A: No. This JEDEC-compliant server memory operates strictly at 1333MHz with CL9. ECC modules prioritize stability and data accuracy over performance tuning and do not support XMP or overclocking.
Q: What warranty and typical failure rate can I expect for this Micron module?
A: It is backed by a 1-year warranty. Built with Micron’s rigorous ECC screening, the AFR (annualized failure rate) is exceptionally low, typically under 0.2%, ensuring reliable 24/7 operation in mission-critical environments.